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Spectra7 Microsystems Inc V.SEV

Alternate Symbol(s):  SPVNF

Spectra7 Microsystems Inc. is an analog semiconductor company. The Company delivers analog semiconductors at a bandwidth, speed and resolution to enable disruptive industrial design for electronics manufacturers in virtual reality (VR), augmented reality (AR), mixed reality, data centers and other connectivity markets. It creates silicon products that enable copper cables to be longer, thinner, lighter and run at higher performance levels. Its family of products features a patented signal processing technology used in the design of active cables and specialty interconnects in data centers, VR, AR, and other connectivity products. It provides chips, such as HT8181 HDMI 2.0 In-Cable Equalizer, VR8200 Ultra-High-Speed DisplayPort Embedded Interconnect Processor, VR8300 Ultra-High-Speed DisplayPort Embedded Interconnect Processor, VR8050 Interconnect Processor, VR8051 Interconnect Processor, GC2502 Data Center Cable Processor, and GC1122 Dual Channel 112Gb/s PAM-4 Linear Equalizer.


TSXV:SEV - Post by User

Bullboard Posts
Post by Aberta1on Oct 05, 2016 9:23pm
172 Views
Post# 25314970

TE Connectivity LTD

TE Connectivity LTDSent an email to TE investors relations regarding the cable.

Received

Hi xxxxxxxxx

 

Regarding your question to TE, the equalizer in our solution is a chip that is designed in and sourced from a third party (TE does not produce equalizer chips).

 

Sujal


 

TE Connectivity (TE), a world leader in connectivity and sensors, today showcased its TE VR Hang Glider (exclusive for CEATEC), in partnership with HTC Vive, at the CEATEC JAPAN 2016 show. TE offers an enhanced visual demonstration of its product innovations through its VR hang glider experience, which is a highlight of TE’s “Powering the Connected IoT World” exhibit.

The VR experience is a combination of the HTC Vive - the world’s leading VR device - and the TE Hang Glider. TE mounted a real hang glider with its efficient and high-performing products, such as the dynamic connector, heat shrink tubing and automotive sensors, which are geared for harsh environments. The HTC Vive device uses TE’s high speed input/output (HSIO) 3-in-1 high-performance multimedia connectivity cable to ensure a stable and reliable user experience. The HSIO cable is embedded with an equalizer that can amplify signals to improve data and power transmission performance. With its user-friendly design, the cable also provides better bending performance and easy, reliable mating functionality.

According to Raymond Pao, vice president of VR New Technology, HTC, “It is a massive inspiration across the industry with the exciting collaboration between HTC Vive and the TE hang glider at CEATEC Japan. HTC Vive is dedicated to provide users with leading innovations to immerse themselves in world of VR. By collaborating with a variety of industries, we are able to showcase the technology's practical application capabilities. Through VR, we are proud to enable enterprise users to explore the possibility of this revolutionary new technology in various fields.”

“The booming VR markets are driving increased demand globally for wireless, high-speed streaming video, processing capabilities, and storage-related products and applications,” said Jason Merszei, vice president & general manager of Asia and EMEA for TE Connectivity’s Data and Devices business. “This poses vast opportunities for TE to provide our engineering expertise and advanced connectivity solutions to the market innovators. Our collaboration with HTC Vive is another example of TE’s agility to provide innovate solutions that ultimately help improve user experiences.”

 


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