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Spectra7 Microsystems Inc V.SEV

Alternate Symbol(s):  SPVNF

Spectra7 Microsystems Inc. is an analog semiconductor company. The Company delivers analog semiconductors at a bandwidth, speed and resolution to enable disruptive industrial design for electronics manufacturers in virtual reality (VR), augmented reality (AR), mixed reality, data centers and other connectivity markets. It creates silicon products that enable copper cables to be longer, thinner, lighter and run at higher performance levels. Its family of products features a patented signal processing technology used in the design of active cables and specialty interconnects in data centers, VR, AR, and other connectivity products. It provides chips, such as HT8181 HDMI 2.0 In-Cable Equalizer, VR8200 Ultra-High-Speed DisplayPort Embedded Interconnect Processor, VR8300 Ultra-High-Speed DisplayPort Embedded Interconnect Processor, VR8050 Interconnect Processor, VR8051 Interconnect Processor, GC2502 Data Center Cable Processor, and GC1122 Dual Channel 112Gb/s PAM-4 Linear Equalizer.


TSXV:SEV - Post by User

Bullboard Posts
Post by Aberta1on Oct 13, 2016 11:35am
174 Views
Post# 25339447

Just Reminding of this..

Just Reminding of this..PSVR4 IMO will be coming around to this.

TE Connectivity (TE), a world leader in connectivity and sensors, today showcased its TE VR Hang Glider (exclusive for CEATEC), in partnership with HTC Vive, at the CEATEC JAPAN 2016 show. TE offers an enhanced visual demonstration of its product innovations through its VR hang glider experience, which is a highlight of TE’s “Powering the Connected IoT World” exhibit.

The VR experience is a combination of the HTC Vive - the world’s leading VR device - and the TE Hang Glider. TE mounted a real hang glider with its efficient and high-performing products, such as the dynamic connector, heat shrink tubing and automotive sensors, which are geared for harsh environments. The HTC Vive device uses TE’s high speed input/output (HSIO) 3-in-1 high-performance multimedia connectivity cable to ensure a stable and reliable user experience. The HSIO cable is embedded with an equalizer that can amplify signals to improve data and power transmission performance. With its user-friendly design, the cable also provides better bending performance and easy, reliable mating functionality.

According to Raymond Pao, vice president of VR New Technology, HTC, “It is a massive inspiration across the industry with the exciting collaboration between HTC Vive and the TE hang glider at CEATEC Japan. HTC Vive is dedicated to provide users with leading innovations to immerse themselves in world of VR. By collaborating with a variety of industries, we are able to showcase the technology's practical application capabilities. Through VR, we are proud to enable enterprise users to explore the possibility of this revolutionary new technology in various fields.”

“The booming VR markets are driving increased demand globally for wireless, high-speed streaming video, processing capabilities, and storage-related products and applications,” said Jason Merszei, vice president & general manager of Asia and EMEA for TE Connectivity’s Data and Devices business. “This poses vast opportunities for TE to provide our engineering expertise and advanced connectivity solutions to the market innovators. Our collaboration with HTC Vive is another example of TE’s agility to provide innovate solutions that ultimately help improve user experiences.”

Merszei added: “We are ready to address the connectivity challenges of the next generation of VR development. Our broad portfolio of connectivity technology and solutions offer better signal and power transmission and can also help provide a user-friendly experience.”

In addition to the VR hang glider experience, TE will be showcasing other connectivity and sensor solutions for applications such as automotive, industrial, aerospace, medical, energy, mobile and appliances at the CEATEC JAPAN 2016 show. The exhibition runs through October 7, 2016 in Makuhari Messe, Chiba, Japan. Please visit the TE booth in the CPS/IoT Technology & Software Area, 6C-153 for more information on the vast portfolio of solutions from TE.

ABOUT TE CONNECTIVITY

TE Connectivity (NYSE: TEL) is a $12 billion global technology leader. Our connectivity and sensor solutions are essential in today’s increasingly connected world. We collaborate with engineers to transform their concepts into creations – redefining what’s possible using intelligent, efficient and high-performing TE products and solutions proven in harsh environments. Our 72,000 people, including over 7,000 engineers, partner with customers in close to 150 countries across a wide range of industries. We believe EVERY CONNECTION COUNTS – www.TE.com.

TE Connectivity, TE connectivity logo, TE, and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies.

HTC Vive is a trademark.


Read more at https://www.stockhouse.com/companies/bullboard?symbol=t.sev&postid=25302070#8Hakb7CIz5bw1EDX.99
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