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Interlink Electronics, Inc. Announces the Hiring of a VP of Operations Based in Shenzhen, China and the Departure of Howard D. Goldberg, Ph.D.

LINK

Interlink Electronics, Inc. (OTC: LINK), is a global leader in sensor and human-machine interface technologies (“Interlink”). Interlink continues to make progress in its transition from an FSR (Force Sensor Resistor) company to a HMI (Human Machine Interface) company. In light of our growth in the Asia Pacific Region, as evidenced by the continued expansion of our manufacturing facility in Shenzhen, China through the hiring additional employees and the launch of Interlink’s Global R&D center in Singapore, Interlink’s Board of Directors has determined that it is important to hire an experienced operations manager, based in Shenzhen, to oversee and work closely with our Shenzhen manufacturing team. We are pleased to announce that John Sirbu, an operations veteran, has agreed to join of the Interlink team as Interim VP Operations, based in Shenzhen, China, starting on October 13, 2014. Mr. Sirbu brings with him over 20 years in executive leadership and manufacturing experience with leading Japanese, European and American companies.

“Interlink’s growth in APAC region and the expansion of our manufacturing efforts in Shenzhen, China, require local executive leadership. I believe that Mr. Sirbu’s extensive experience will greatly benefit the operations of Interlink’s Shenzhen manufacturing facility as well as the growth of our business in the APAC region,” stated Steven N. Bronson, Interlink’s Chairman and CEO.

Based on Interlink’s current and future expansion of operations in the APAC Region, it has been determined that Howard D. Goldberg, Ph.D. will be leaving Interlink effective September 30, 2014. Steven N. Bronson, our Chairman and CEO shall assume the title and responsibilities of President of Interlink effective October 1, 2014.

“We truly wish Howard all the best with his future endeavors and are grateful to him for his contributions to Interlink during his tenure,” stated Mr. Bronson. “I believe strongly in Interlink’s future and look forward to working closely with the Interlink team and to drive our business to the next level,” continued Mr. Bronson.

About Interlink Electronics, Inc.

Interlink Electronics is a world-leading trusted advisor and technology partner in the advancing world of human-machine interface and sensor technologies. Interlink Electronics has led the printed electronics industry in its commercialization of its patented Force-Sensing Resistor (FSR®) technology, which has enabled rugged and reliable human-machine interface ("HMI") solutions. For over 29 years, Interlink Electronics' solutions have focused on handheld user input, menu navigation, cursor control, and other intuitive interface technologies for the world's top electronics manufacturers. Interlink Electronics has a proven track record of supplying human-machine interface solutions for mission-critical applications in a wide range of markets, including, but not limited to, consumer electronics, automotive, industrial, and medical devices. Interlink Electronics serves a world-class customer-base from its corporate headquarters in Camarillo, California (greater Los Angeles area), manufacturing facility in Shenzhen, China, distribution and warehouse facility in Hong Kong, global R&D office in Singapore, global sales office in the United Kingdom, and sales office in Japan. For more information, please see our website at: http://www.interlinkelectronics.com.

FORWARD LOOKING STATEMENTS: This release contains "forward-looking statements" involving a number of risks and uncertainties as defined in the Private Securities Litigation Reform Act of 1995. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: historical losses and negative cash flow, the success of business divestitures and acquisitions, the ownership of the majority of our stock by a small group of investors, our success in predicting new markets and the acceptance of our new products, efficient management of our infrastructure, the pace of technological developments and industry standards evolution and their effect on our target product and market choices, the effect of outsourcing technology development, changes in the ordering patterns of our customers, a decrease in the quality and/or reliability of our products, protection of our proprietary intellectual property, competition by alternative sophisticated as well as generic products, pending litigation against Interlink Electronics, historical weaknesses in internal controls over financial reporting, continued availability of raw materials for our products at competitive prices, disruptions in our manufacturing facilities, risks of international sales and operations including fluctuations in exchange rates, compliance with regulatory requirements applicable to our manufacturing operations, and customer concentrations. The forward-looking statements contained in this release should be considered in light of these risk factors.



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