Molex and TE Connectivity Collaborate on Next-Generation Data Communications Electronic Products
Dual Source Alliance for select High-Speed Input/Output and Backplane Products, will:
- Drive Interoperability; Share Common Test Plans
- Increase Product Availability
- Accelerate Innovation
Two global leaders in the design and manufacturing of connectors for electronic products today announced a Dual Source Alliance
(DSA) agreement to each produce a new generation of high-speed input/output (I/O) and backplane connectors, and cable assemblies
for data communications applications.
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Molex, LLC and TE Connectivity (TE) will collaborate on the launch and promotion of select new connector and cable assembly
products that enable the growing number of high-speed applications required as data centers evolve with hyperscale models and
increased virtualization. The DSA will support today’s data speeds and up to 56 Gbps and beyond. The scope of the agreement
includes next-generation connector products, and the DSA is intended to build on the successful history with standard second source
agreements for products such as: zSFP+ interconnects, zQSFP+ interconnects, CDFP interconnects, microQSFP interconnects, and
Nano-Pitch I/O interconnects.
The DSA goes well beyond each company simply producing similar products. It is focused on creating increased availability of
high-speed solutions — composed of connectors, cages and cable assemblies — that are interoperable. The DSA includes self-testing:
TE and Molex will conduct cross-testing of select products and provide these test reports to customers. This will provide an
assurance of product compatibility and help customers minimize their qualification time. Overall, this can result in cost savings
for customers, improving the productivity and efficiency of their systems. Also, TE and Molex will bring products covered under the
DSA to market in a tighter time frame to better support customers’ design and qualification processes.
Data centers are rapidly evolving to deliver higher density, higher speeds and richer virtualization models. High-performance,
high-speed connectors and cable assemblies must support the system data requirements of new data storage, servers, switches,
routers and other applications. These connectivity products typically offer superior high-speed electrical performance, which in
turn requires sophisticated connector and cable assembly designs with advanced features for high-speed signaling, EMI containment
and thermal efficiencies. This Molex and TE alliance aims to produce connectors and cable assemblies with these vital
characteristics. This agreement is intended to offer increased product availability to customers and reduce the risk of new
technology adoption by providing customers with the choice of two independent suppliers with interoperable products.
“The agreement enables TE and Molex to give customers more flexibility and solutions in the future. The data communications
industry is changing rapidly due to the growing demand for data and high-speed communications in just about every industry
application. Our customers require the most advanced technology and need solutions to help them scale,” said James O’Toole, segment
president of TE Connectivity Communications Solutions.
“Molex is pleased to be collaborating with TE Connectivity on this forward-looking alliance,” said Joe Nelligan, COO, Molex.
“The market requires next-generation connector technology that will meet demands for higher speeds, and the cooperative venture
between our two companies will help address this need through co-tested, dual-sourced products that can be dropped in
interchangeably.”
About Molex:
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more
than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer
electronics, industrial, automotive, commercial vehicle and medical. For more information, please visit www.molex.com.
Molex Resources:
Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other jurisdictions.
About TE Connectivity
TE Connectivity (NYSE: TEL) is a $12 billion global technology leader. Our connectivity and sensor solutions are essential in
today's increasingly connected world. We collaborate with engineers to transform their concepts into creations – redefining what's
possible using intelligent, efficient and high-performing TE products and solutions proven in harsh environments. Our 75,000
people, including over 7,000 engineers, partner with customers in close to 150 countries across a wide range of industries. We
believe EVERY CONNECTION COUNTS – www.TE.com.
TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of
companies.
Molex:
Outlook Marketing Services
Christa Carroll
630-408-9164
christa@outlookmarketingsrv.com
or
TE Connectivity:
Story Public Relations
Michael Schoolnik
415-674-3816
michael@storypr.com
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