Post by
lscfa on Jun 10, 2015 1:10am
Semiconductor inspection market
The current estimated size of the 3D interconnect inspection market is $300 million per year. This precludes the new requirement for inspection of the emerging 3D IC structures and this emerging inspection and metrology market size is estimated to exceed $500 million per year. XwinSys' goal is to capture 10% of this market with its initial product offering designated XWS100. The Company's IP is generic in nature and can be subsequently leveraged for other applications which would significantly increase the available market size. https://www.stockhouse.com/news/press-releases/2014/06/26/eurocontrol-provides-update-on-xwinsys-subsidiary-advancements
Comment by
lscfa on Sep 18, 2015 12:18pm
this bears repeating.......