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International Business Machines Corp IBM

Alternate Symbol(s):  N.IBM | IBM.30A

International Business Machines Corporation is engaged in addressing the hybrid cloud and artificial intelligence (AI) opportunity with a platform-centric approach, focused on providing client value through a combination of technology and business expertise. Its segments include Software, Consulting, Infrastructure and Financing. Its Software segment comprises two business areas: Hybrid Platform & Solutions, which includes software to help clients operate, manage and optimize their IT resources and business processes within hybrid, multi-cloud environments, and transaction processing, which includes software that supports client’s mission-critical, on-premises workloads in industries such as banking, airlines and retail. Consulting segment is engaged in business transformation, technology consulting and application operations. Infrastructure segment is engaged in hybrid infrastructure and infrastructure support. Financing segment is engaged in client financing and commercial financing.


NYSE:IBM - Post by User

Post by juddwon Apr 03, 2000 9:42am
356 Views
Post# 1711667

Faster chips-

Faster chips- IBM announces faster chips By Fiona Harvey - 3 Apr 2000 00:52GMT International Business Machines, the world's biggest computer manufacturer, will on Monday announce it has invented a way of making microchips that will increase their speed by a third, boosting the performance of all computers. John Kelly, general manager of IBM's Microelectronics Division, said: "This represents a fundamental shift in the way chips are built, and will help IBM maintain its lead in the industry." Industry analysts said the technology, using a material called "low-k dielectric", could become the standard for future generations of semiconductors, giving IBM an edge in a highly competitive market. Computer users will see the benefit of the new chips in faster machines and better graphics, while mobile phones using them will have longer battery life because the new chips use less power. The global semiconductor market was worth $160bn in 1999, and is forecast to grow to more than $250bn by 2003, according to Dataquest, the market research company. Small volumes of chips using the new technology are in production now, and IBM plans to start high volume production in the first half of next year. IBM would not say how many it plans to produce. The development concerns the insulation of the copper wires inside the chip. In order to make chips smaller and more efficient, the wires need to be closer. But if they are too close, the electrical "crosstalk" or interference disrupts the signals travelling down the wires. Low-k dielectric is an insulating material used to shield the millions of individual wires on a chip. Combining this material with the copper is "extremely difficult", said analysts. The development puts IBM six months ahead of rivals such as Intel and Motorola of the US and Hitachi and Toshiba of Japan, said Richard Doherty, analyst at Envisioneering, a US engineering and IT consulting group. Intel is the world's biggest manufacturer of semiconductors, with about 40 per cent of the market by revenue, and IBM is roughly fourth biggest, with between 7 and 10 per cent, he said. Within a few years, all semiconductors will be built on this technology, said Keith Diefendorff of MicroDesign Resources, a research company. IBM's technique is proprietary, but the material it uses is available from Dow Chemical of the US. Other manufacturers will make their own versions of the technology now IBM has shown the way, Mr Diefendorff said. Mr Doherty said he expected IBM to be the second biggest manufacturer of chips, after Intel, in five years thanks to its technology and the diverse range of its semiconductor products.
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