RE: RE: POET rival Just started looking at it. First impressions...looks interesting although does not sound monolithic to me. Lots of discription of heat sinks which implies that it generates significant heat rather than highly efficient transfer. Too early to judge but if CISCO has invested my impression is it could light a fire under the competitors to buy POET...Again though we are talking about an Optical interconnect and not logic or memory...(not a processor) Not POET.
There is provided according to the present invention an optoelectronic chip assembly including a printed circuit board (hereinafter: PCB), a heat sink, a large matrix of drivers and active optical elements coupled by holders to the heat sink, a substrate bridging between the PCB and the drivers, and insulation between the passive optical elements and the matrix of drivers, preferably integrated in a driver chip, and active optical elements. This arrangement enables more than Terabit per second of data transfer. The driver chip includes both analog and digital circuits.
There is thus provided in accordance with the present invention an optoelectronic assembly including a heat sink, a plurality of active optical elements coupled to the heat sink, a plurality of passive optical elements disposed in optical communication with the plurality of active optical elements, and a structure mounted on the heat sink for supporting the plurality of passive optical elements mechanically and thermally isolated from the plurality of active optical elements.
There is also provided, in accordance with the present invention, an optoelectronic chip assembly including a printed circuit board (PCB) coupled to a substrate, an aperture formed through the printed circuit board and through the substrate, a heat sink, an array of active electro-optical elements mounted in the aperture and connected to a driving chip controlled by the PCB, wherein the driving chip is coupled to the heat sink. Preferably, the assembly further includes a plurality of passive optical elements disposed for optical communication and data transfer with said active electro-optical elements, but thermally isolated therefrom.
There is further provided, in accordance with the invention, an optoelectronic chip assembly including a plurality of passive optical elements; a plurality of active electro-optical elements disposed for optical communication with the passive optical elements; a heat sink; a matrix of drivers for the active electro-optical elements coupled to the heat sink; a printed circuit board (PCB) for controlling the matrix of drivers; and a substrate bridging between the PCB and the matrix of drivers; wherein the passive optical elements are thermally isolated from the active electro-optical elements.
There is also provided, in accordance with the invention, a method for forming an optoelectronic assembly, the method including: providing a heat sink; coupling a printed circuit board (PCB) to a substrate; forming an aperture through the printed circuit board and through the substrate; coupling an array of active electro-optical elements to the substrate for control of the elements by the PCB; mounting the array of active electro-optical elements in the aperture; and coupling the driving chip to the heat sink.