Eurocontrol Technics Ord EUCTF

RE:Semiconductor inspection market

[lscfa]

Revised MD&A says:

The  Company  intends  to  invest  up  to  US$1.5  million  in  fiscal  2015  to  advance  XwinSys  towards  achieving certain  milestones  and  depending  on  the  outcome  of  the  milestones  that  have  been  set,  the  Company  may begin  commercial  production  in  2016.   XwinSys’  enhanced  hybrid  concept  is  supported  by  an  IP  package including  a  portfolio of  pending  patents,  state-of-the-art  know-how  and  trade  secrets.  This  ensures  that  the Company  will  be  able  to  establish  first-mover  status  and  maintain  this  advantage  to  capture  significant market share.

lscfa wrote: The current estimated size of the 3D interconnect inspection market is $300 million per year. This precludes the new requirement for inspection of the emerging 3D IC structures and this emerging inspection and metrology market size is estimated to exceed $500 million per year. XwinSys' goal is to capture 10% of this market with its initial product offering designated XWS100. The Company's IP is generic in nature and can be subsequently leveraged for other applications which would significantly increase the available market size. https://www.stockhouse.com/news/press-releases/2014/06/26/eurocontrol-provides-update-on-xwinsys-subsidiary-advancements