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Eurocontrol Technics Ord EUCTF

"Eurocontrol Technics Group Inc is a Canada-based company involved in acquisition, development, and commercialization of security, authentication, verification and certification markets. The company through its subsidiaries is engaged in designing, manufacturing, marketing of energy-dispersive X-ray fluorescence (ED-XRF) systems, and developing technology and property that combines two-dimensional (2D) and three-dimensional (3D) image processing technology respectively."


OTCPK:EUCTF - Post by User

Comment by frs1960on May 10, 2016 5:21am
164 Views
Post# 24856717

RE:Another milestone for XwinSys

RE:Another milestone for XwinSysThe PR:

Toronto, CANADA, May 10, 2016 - Eurocontrol Technics Group Inc. (TSX Venture: EUO) (“Eurocontrol” or the “Company”), a Canadian public company specializing in the acquisition, development and commercialization of innovative authentication, verification and certification technologies, is pleased to announce that its wholly-owned subsidiary, XwinSys Technology Development Ltd. (“XwinSys”), has been granted a patent from the United States Patent and Trademark Office for its patent application # 14/234,169 made in 2014 covering a method and a system for inspection of voids in a bump.

This process patent protects XwinSys ONYX and AGATE systems which are non-destructive in-line metrology systems designed to handle the 3D-IC current and future challenges using the advent of X-Ray Technology for semiconductor metrology. These systems with their hybrid configuration of X-Ray analysis, automated 3D microscope and 2D image processing enable both inspection and metrology capabilities, along with small-scale material composition and 3D structure analysis.

Bruce Rowlands, Chairman and CEO stated, "The acceptance of this patent application by the United States Patent and Trademark Office is a significant milestone for our subsidiary XwinSys. This invention in the field of wafer inspection is new for its ability to detect the existence of voids in a bump and to calculate voids volume along with other critical dimensions relative to bump inspection, such as bump height, pillar height and solder composition ensuring overall product quality.“

Bruce Rowlands, Chairman and Chief Executive Officer stated: “With record revenues in 2015 and Eurocontrol’s sale of GFI, 2016 is a transformational year for Eurocontrol. We’re looking forward to revenue growth in the future through our ongoing relationship with SICPA / GFI both in earn-out revenue and through Xenemetrix’s exclusive supply agreement, organically through our increased R&D investment in Xenemetrix’s and XwinSys’s leading edge technologies as well as growing revenues through acquisition.”


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