RE:RE:S7 projections from the prospectus Pokerchamp,
If they need financing for further R&D in the areas mentioned below in the prospectus
I view it as an extremely positive event as USB 3.1 interconnect products are heating up. Just ask Apple.
The Corporation expects to spend US$2,000,000 of the proceeds of the Offering on research and development costs on continuing development of the Corporation’s VR/AR products and data center interconnect products, and up to an additional US$1,500,000 on the VR/AR and data center products over the next twelve months from the Corporation’s existing working capital.
If additional funds become available, the Corporation anticipates spending up to a further US $3,100,000 over the twelve months following the closing of the Offering on its USB3.1 consumer interconnect products, data center product line and other products. Research and development costs consist mainly of compensation for engineering staff and the cost of their design tools, project related costs for the production of sample semiconductors (“tape-out”) and purchases or licensing of intellectual property from third parties to be incorporated in the Corporation’s design. The Corporation conducts all of its own research and development. Compensation and design tool costs are incurred regularly over time.
Tape-out and intellectual property purchases are incurred at milestones
during the product development cycle. See “R&D Expenses” and “Business Objectives and Milestones”.