EMIPA-Bond Program - EMIPA expects to commence the bonds offering in the next few weeks, the closing of which would be conditional upon securing the remaining of OSP financing structure as summarized above.
- Bonds Program highlights:
Total Offering Amount: Bs 327.120.000,00 ($47 million)
Units: 32.712
Face value: Bs. 10.000,00 / unit
Term: 1,080 days (since issuance date)
Interest rate: 6.8%
Security: Don Mario Plant – New circuits
Covenants: financial ratios (debt coverage, debt coverage third parties and leverage).