Eurocontrol Technics Ord EUCTF

Could I Be Correct On My Samsung Partnership Theory ?????

[homerunstock]

Samsung Electro-Mechanics to invest W263b in chip technology Published: 2016-07-22 15:23 Updated: 2016-07-22 15:24 [THE INVESTOR] Electronic components firm Samsung Electro-Mechanics said on July 22 that it would invest 263.2 billion won (US$231.90 million) in beefing up its capability in chip packaging, an encapsulation process aimed at preventing erosion and damage. The investment amount accounts for 6.1 percent of the firms equity. Through the investment, Samsung Electro-Mechanics will develop the next-generation chip packaging facilities, which will be deployed at Samsung Displays manufacturing complex in Cheonan, South Chungcheong Province. Teaming up with Samsung Electronics system LSI division, in charge of developing non-memory chips such as application processors, the electronic components firm will start a project to develop the fan-out wafer level package or FoWLP technology, which can reduce the size of a chip and production cost in a dramatic manner.

[tpaymans]

Sory but this has not much to do with EUO and their advanced technology: XwinSys's unique and patented multi-mode technology system meets both fast in-line and in-depth metrology challenges, without interrupting the process flow. Samsung is investing in: chip packaging, an encapsulation process aimed at preventing erosion and damage. As for XwinSys, they hope to start commercial