MoSys to Showcase Packet Processing Accelerators and 28G SerDes Products for 400G Networking Line Cards at Interop Las Vegas 2013

MoSys (NASDAQ: MOSY):

Who: MoSys (NASDAQ: MOSY), a leader in semiconductor solutions that enable fast, intelligent data access for network and communications systems, is exhibiting at Interop Las Vegas 2013 in booth 744. MoSys will feature the newest additions to its Bandwidth Engine® and LineSpeed™ product families which enable high-density networking line cards to scale to 400 Gigabits per second (Gbps) and beyond. Booth demonstrations will include interoperability with leading FPGAs using Bandwidth Engine 2 – Burst high-speed, low latency 12.5G interfaces to access the devices' integrated 0.5 Gigabit high-speed intelligent memory core. In addition, MoSys will show its recently-announced LineSpeed™ 100G Multi-Mode Gearbox, which supports high-density 10G, 40G and 100G OTN and Ethernet interfaces in networking line card and optical module applications.

What: Interop® drives the adoption of technology, providing knowledge and insight to help IT and corporate decision-makers achieve business success. Part of UBM Tech's family of global brands, Interop is the leading business technology event series. Through in-depth educational programs, workshops, real-world demonstrations and live technology implementations in its unique InteropNet program, Interop provides the forum for the most powerful innovations and solutions the industry has to offer. Interop Las Vegas is the flagship event held each spring, with Interop New York held each fall, with annual international events in Mumbai and Tokyo, all produced by UBM Tech and partners. For more information about these events, visit www.interop.com.

When: Interop Las Vegas 2013 begins on May 6, 2013 and concludes on May 10, 2013. The exhibition takes place from May 7-9.

Where: Mandalay Bay Convention Center
3950 Las Vegas Blvd S
Las Vegas, NV

About MoSys, Inc.

MoSys, Inc. (NASDAQ: MOSY) is an IP-rich fabless semiconductor company that provides high performance solutions for fast, intelligent data access in network and communications systems. Engineered and built for high-reliability carrier and enterprise applications, MoSys' products are breaking bandwidth barriers™ in data processing to allow for faster packet access and analysis, expanded user capacity and new capabilities required by the expanding global infrastructure. MoSys’ Bandwidth Engine® family of ICs combines the company's patented 1T-SRAM® high-density, embedded memory and high-speed, 10 Gigabits per second serial interface with its intelligent access technology and a highly efficient GigaChip™ Interface transport protocol to eliminate bottlenecks in high-speed data access. MoSys is headquartered in Santa Clara, California, and more information is available at www.mosys.com.

MoSys, 1T-SRAM and Bandwidth Engine are registered trademarks of MoSys, Inc. in the US and/or other countries. Breaking Bandwidth Barriers, GigaChip, LineSpeed and the MoSys logo are trademarks of MoSys, Inc. All other marks mentioned herein are the property of their respective owners.