Power Integrations Introduces Highly Integrated PFC IC for Compact Consumer Products and PCs

Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today introduced HiperPFS-2, a new family of high-efficiency, active-PFC ICs for offline applications from 100 W to 380 W. HiperPFS-2 ICs combine a boost PFC controller, driver, PFC power MOSFET, PFC diode and protection circuits in one package, enabling exceptionally compact designs ideal for small-form-factor power supplies as used in mini-tower PCs, all-in-one PCs, game console adapters and TVs.

The HiperPFS-2 controller uses a variable-frequency CCM algorithm providing up to 97% efficiency across the load spectrum from 20% to 100% and power factor greater than 0.9 at 20% load with 265 VAC input for designs over 200 W. Including line-connected sense elements, the new device contributes just 60 mW to a typical high-power adapter’s 300 mW no-load budget. Conducted and radiated EMI are minimized due to the integrated soft-recovery diode and short parasitic inductance loop which results from the highly integrated, compact design.

Comments Edward Ong, product marketing manager for Power Integrations: “The HiperPFS-2device is the most highly integrated PFC solution available. This enables designers to cost-effectively meet the 80 PLUS® Gold and Platinum efficiency standards in space-constrained PCs. The device’s excellent no-load performance simplifies design and reduces cost in high-power adapter applications targeting aggressive standby or no-load specifications.”

Key applications for HiperPFS-2 ICs include TVs, PCs, game console adapters, telecoms and industrial products such as blowers, motor drives and chargers. A new reference design based on the HiperPFS-2 IC, DER-294, describes a 350 W output power boost CCM PFC board with wide range AC input. DER-294 is able to attain > 97% efficiency for 230 VAC across a wide load range and > 0.9 PF at 20% load- see http://www.powerint.com/sites/default/files/PDFFiles/der294.pdf.

HiperPFS-2 devices are sampling now in two of Power Integrations’ innovative eSIP-16 packages: the standard eSIP16-D (H package) and the L-bend eSIP16-G (L package) for low-profile applications. Both feature an isolated metal heatsink pad for simple and easy mounting. HiperPFS-2 family devices are priced from $0.959 each in 10K quantities.

About Power Integrations

Power Integrations, Inc., is a Silicon Valley-based supplier of high-performance electronic components used in high-voltage power-conversion systems. The company’s integrated circuits and diodes enable compact, energy-efficient AC-DC power supplies for a vast range of electronic products including mobile devices, TVs, PCs, appliances, smart utility meters and LED lights. CONCEPT IGBT driver systems enhance the efficiency, reliability and cost of high-power applications such as industrial motor drives, solar and wind energy systems, electric vehicles and high-voltage DC transmission. Since its introduction in 1998, Power Integrations’ EcoSmart® energy-efficiency technology has prevented billions of dollars’ worth of energy waste and millions of tons of carbon emissions. Reflecting the environmental benefits of the company’s products, Power Integrations’ stock is included in the NASDAQ® Clean Edge® Green Energy Index, The Cleantech Index®, and the Ardour Global IndexSM. For more information, including design-support tools and resources, please visit www.powerint.com; visit Power Integrations’ Green Room for a comprehensive guide to energy-efficiency standards around the world.

Power Integrations, HiperPFS, EcoSmart, and the Power Integrations logo are trademarks or registered trademarks of Power Integrations, Inc. All other trademarks are the property of their respective owners.