AltoBeam,
a Digital Television (DTV) demodulator IC maker, and United
Microelectronics Corporation (NYSE:UMC)(TWSE:2303) (“UMC”), a leading
global semiconductor foundry, today announced the release of AltoBeam’s
DVB-T2/T/C/S2/S demodulator to target DTV markets that have adopted
these standards. The ATBM7812 utilizes UMC’s proprietary URAM embedded
memory technology on 300mm wafers to enable higher performance and
smaller chip size.
The ATBM7812 is in full compliance with the following latest DVB
specifications:
-
ETSI EN 302 755 V1.3.1 (DVB-T2)
-
ETSI EN 300 744 V1.6.1 (DVB-T)
-
ETSI EN 300 429 V1.2.1 (DVB-C)
-
ETSI EN 302 307 V1.2.1 (DVB-S2)
-
ETSI EN 300 421 V1.1.2 (DVB-S)
In addition, the ATBM7812 fully satisfies the following latest agency
specifications (RF components):
-
NorDig Unified Spec V2.4 and NorDig Unified Test Spec V2.2.2
-
D-Book 7 V2
A team of AltoBeam engineers successfully demonstrated an
ATBM7812-powered STB in the Broadcast Asia Conference held in Singapore
between June 18 and 21, 2013. The ATBM7812 showed excellent receiving
robustness in demodulating various DVB-T2 broadcasting signals,
including multi-PLP with L1 post-scrambling and T2-Lite.
“AltoBeam is a leader in the Chinese DTMB market with majority market
share,” said Dr.
Steve Chaohuang Zeng, CEO of AltoBeam. “The release of the ATBM7812
helps us expand beyond the Chinese market and further strengthens our
position in the DTV space. Currently, over a dozen manufacturers have
started designs using the ATBM7812.” “The ATBM7812 reconfirms AltoBeam’s
commitment to the digital TV broadcasting,” added Qi
Deng, VP of International Sales for AltoBeam. “We look forward to
serving the DVB market with the level of product performance and
customer support that has been our trademark in the DTMB market.”
Steve Wang, vice president of Asia sales division at UMC, said, “We are
happy to bring the benefits of UMC’s leading-edge technologies to
leading China customers such as AltoBeam. With highly comprehensive
technology solutions that include our proven 300mm URAM process, we look
forward to further partnering with China’s IC design companies to
increase their market competitiveness.”
UMC’s URAM process is the company's patented embedded DRAM (eDRAM)
technology. URAM enables higher performance, lower power consumption,
and reduced chip size compared to traditional embedded SRAM or external
DRAM. UMC offers the technology for a broad range of processes down to
65nm, with years of successful manufacturing experience and proven
yields. URAM is ideal for multiple applications including demodulator,
timing control, touch display driver, ASIC networking, etc.
The ATBM7812 is now available for design-in.
For more information about the ATBM7812, please visit the product page
at http://www.altobeam.com/en/products_sch.html.
Copyright Business Wire 2013