Advanced Semiconductor Engineering, Inc (ASE, NYSE: ASX, TAIEX: 2311)
announced today a joint development and production agreement for
assembly services of automotive products with Infineon Technologies AG
(FSE: IFX / OTCQX: IFNNY). The collaboration will focus on enabling
copper wire bonding for QFP packages in automotive microcontrollers and
manufacturing.
“Enabling copper wire bonding for QFP packages in microcontrollers will
further enhance our competitive strength in the automotive market,” said
Peter Schaefer, VP and GM of the Automotive Microcontroller business
unit at Infineon Technologies. “We trust in ASE with their strong
manufacturing background to fulfill the stringent automotive market
quality requirements and build on the long existing partnership to
enlarge our current QFP portfolio for future microcontrollers.”
One of the major drivers in the semiconductor industry’s use of copper
was the rising cost of gold. Copper wire bonding has made IC assembly
more competitive in terms of cost. Copper also has excellent performance
in thermal and electrical conductivity. The ASE Group has been a
forerunner in copper wire bonding assembly manufacturing services since
2008 and has shipped more than 25 billion units of copper wire IC
packages to date.
“This announcement marks another milestone in ASE’s technology roadmap.
The use of copper wire bonding in packages for the automotive market
requires adherence to a higher threshold of quality assurance
standards,” said Dr Tien Wu, COO of the ASE Group. “Our collaboration
with Infineon will enable ASE to learn and adopt world class standards
from a leading automotive semiconductor company.”
About ASE Group
The ASE Group is the world's largest provider of independent
semiconductor manufacturing services in assembly, test, materials and
design manufacturing. As a global leader geared towards meeting the
industry’s ever growing needs for faster, smaller and higher performance
chips, the Group develops and offers a wide portfolio of technology and
solutions including IC test program design, front-end engineering test,
wafer probe, wafer bump, substrate design and supply, wafer level
package, flip chip, system-in-package, final test and electronic
manufacturing services through Universal Scientific Industrial Co Ltd, a
member of the ASE Group. The Group generated sales revenues of US$6.5
billion in 2012 and employs over 57,000 people worldwide. For more
information about the ASE Group, visit www.aseglobal.com.
Copyright Business Wire 2013