Silicon Integration Initiative (Si2) announced today its sponsorship of
the 3D Architectures for Semiconductor Integration and Packaging
Conference (3D ASIP). This conference will be held December
10-12, 2014, at the Hyatt Regency San Francisco Airport, Burlingame,
California, and is organized by RTI International. Steve Schulz,
President and CEO of Si2, will deliver one of the keynote addresses, “A
Design Ecosystem for Internet of Things, How 3D IC Standards will Enable
a New Growth Paradigm.”
“Although 3D integrated circuits (3DICs) have long been anticipated as
the major emerging alternative to classical process scaling, the coming
wave of devices driving the Internet of Things (IoT) era will mandate a
new set of integration requirements that only 3DICs can properly
satisfy,” said Steve Schulz, President and CEO of Si2. “The need to
integrate a wide range of functionality - spanning digital, memory,
analog, RF, MEMS, sensors, and energy harvesters - cannot be
economically addressed exclusively with single-die solutions. Yet the
challenges also extend into new design methodologies supporting extreme
low power operation, custom packaging co-design and optimization, and
including system-level interfaces with embedded software and big data
analytics. By analyzing the characteristics of upcoming growth market
categories from the system level, we can assess the changing design
methodologies required and, from that, infer the new types of design
data exchanges needed to support cost-effective design involving 3DICs.”
Si2’s members have been supporting a range of new 3D design flow
standards under the Open3D Technical Advisory Board. These include the
already-released Chip-Package Interface Protocol standard supporting
multi-die power distribution networks, a Design Exchange Format for
Thermal Management, and a Pathfinding specification for 3D design
optimization. An industry survey of priorities is being developed to
guide the next phase of standards development to enable an efficient
3DIC design ecosystem.
Now celebrating its 11th year, the longest running conference series on
this topic – 3D ASIP – continues to be an outstanding venue to meet with
leaders from around the world to learn and discuss the latest technology
and market insights into 2.5/3D device and systems integration and
packaging. The conference format offers attendees a platform to gain the
latest information from invited speakers on technology progress and
industry trends that define this sector today and tomorrow. Along with
the invited presentations, the full program includes two preconference
symposiums, and various networking functions with opportunities to meet
and talk with fellow industry leaders.
Registration and additional information is available at: www.3dasip.org.
About the Open3D TAB
The Open3D TAB is chartered to define open standards for design data
formats and interfaces to enable interoperable 2.5D and 3D design flows
and co-design Member companies are: Altera (NASDAQ: ALTR), AMD (NYSE:
AMD), ANSYS (NASDAQ:ANSS), Atrenta, Cadence Design Systems (NASDAQ:
CDNS), Fraunhofer Institute, GLOBALFOUNDRIES, Helic S.A., IBM (NYSE:
IBM), Intel (NASDAQ: INTC), Invarian, Mentor Graphics (NASDAQ: MENT),
Qualcomm (NASDAQ:QCOM), R3Logic, SEMATECH, STMicroelectronics (NYSE:
STM), and Texas Instruments (NYSE: TXN).
About Si2
Si2 is the largest organization of industry-leading semiconductor,
systems, EDA and manufacturing companies focused on the development and
adoption of standards and shared R&D collaboration to improve the way
integrated circuits are designed and manufactured. Now in its 26th year,
Si2 is uniquely positioned to enable timely collaboration through
dedicated staff and a strong implementation focus driven by its member
companies. Si2 represents over 100 companies involved in all parts of
the silicon supply chain throughout the world. See www.si2.org.
Copyright Business Wire 2014