MOUNTAIN VIEW, Calif., May 30, 2018 /PRNewswire/ --
Highlights:
- Synopsys FineSim Pro FastSPICE tool delivers 2X simulation speed-up for 3D NAND Flash
- Monte Carlo optimizations enable additional 2X throughput for variability analysis
- FineSim Pro optimized to handle large power distribution networks in 3D NAND Flash
Synopsys, Inc. (Nasdaq: SNPS) today announced that it has collaborated with Toshiba Memory Corporation to accelerate the
verification of Toshiba Memory Corporation's BiCS FLASH™ vertically stacked three-dimensional (3D) flash memory. By
working closely with Toshiba Memory Corporation, Synopsys introduced innovative simulation algorithms in its FineSim®
Pro FastSPICE tool to address the increased design complexity of 3D NAND Flash memory. These new technologies improve simulation
speed by an average of 2X, thereby reducing multi-day simulation runs to less than a day.
Compared to traditional Flash devices, 3D Flash devices have much larger memory arrays, more complex analog and programming
circuits, and extensive power distribution network. Additionally, due to the stacked memory array structure, 3D Flash
designs must deal with increased coupling effects due to layout parasitic elements. This increased complexity results in
multi-day simulation times when using existing circuit simulation technology. Through close collaboration with Toshiba Memory
Corporation, the latest release of FineSim Pro FastSPICE delivers several key technologies specifically optimized for 3D Flash
simulation, for efficient handling of massive array structures, large power distribution network, increased layout parasitic
elements, and high-precision analog circuits.
"FineSim has been our signoff circuit simulator since early 2000. Our long collaboration with Synopsys has enabled us to
develop best-in-class Flash memory products for a broad range of applications," said Shigeo (Jeff)
Ohshima, Technology Executive SSD Application Engineering of Toshiba Memory Corporation. "By working closely with Synopsys
we're able to deploy FineSim Pro for verification of our latest BiCS Flash memories and meet our stringent quality and
reliability requirements."
"Advanced flash memory designs require extensive circuit simulation to ensure design robustness, reliability, and cost
competitiveness," said Paul Lo, corporate vice president of Engineering in the Design Group at
Synopsys. "Our team is committed to continuing our close collaboration with Toshiba Memory Corporation to deliver novel circuit
simulation technologies to meet the challenging needs of simulating complex 3D NAND Flash memories and enable Super Chips with
Synopsys™."
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the
electronic products and software applications we rely on every day. As the world's 15th largest software company,
Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also
growing its leadership in software security and quality solutions. Whether you're a system-on-chip (SoC) designer creating
advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has
the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.
Editorial Contact:
James Watts
Synopsys, Inc.
650-584-1625
jwatts@synopsys.com
View original content:http://www.prnewswire.com/news-releases/toshiba-memory-corporation-and-synopsys-collaborate-to-accelerate-3d-flash-memory-verification-300656199.html
SOURCE Synopsys, Inc.