HSINCHU, Taiwan, Jan. 3, 2019 /PRNewswire-FirstCall/ -- ChipMOS
TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an
industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will be
presenting at the Credit Suisse 2019 Greater China Technology and Internet Conference, at the Conrad Hong Kong on Thursday, January 10 and Friday, January 11, 2019.
Management from the Company, including Jesse Huang, Vice President of New Product Development
Management Center and Strategy and Investor Relations, will host meetings with institutional investors to discuss the Company's
recent financial results, business trends and growth opportunities. There will be no webcast of the conference. The
Company's investor update is currently available on the investor relations' section of its website at www.chipmos.com.
About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test
services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in
Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including
leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.
Forward-Looking Statements
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words
such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar
expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial
projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect
to future operations, products and services, and statements regarding future performance. Actual results may differ materially in
the future from those reflected in forward-looking statements contained in this document, due to various factors. Further
information regarding these risks, uncertainties and other factors are included in the Company's most recent Annual Report on
Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company's other filings with the SEC.
Contacts:
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SOURCE ChipMOS TECHNOLOGIES INC.