ANDOVER, Mass. and KYOTO, Japan, April 10, 2019 (GLOBE NEWSWIRE) -- Kyocera Corporation (TOKYO: 6971)
and Vicor Corporation (NASDAQ: VICR) will collaborate on next-generation Power-on-Package (PoP) solutions to maximize
performance and minimize time-to-market for emerging processor technologies, the companies announced today. As a part of the
collaboration between the two technology leaders, Kyocera will provide the integration of power and data delivery to the processor
with organic packages, module substrates and motherboard designs. Vicor will provide Power-on-Package current multipliers enabling
high density, high current delivery to processors. This collaboration will address the rapid growth of higher performing
processors, which has created proportionate growth and complexity in high-speed I/Os and high current consumption demands.
Vicor’s Power-on-Package technology enables current multiplication within the processor package, allowing for
higher efficiency, density, and bandwidth. Providing current multiplication within the package can reduce interconnect losses by up
to 90 percent, while allowing processor package pins, typically required for high current delivery, to be reclaimed for expanded
I/O functionality. Vicor’s Power-on-Package solutions were featured at the NVIDIA GPU Technology Conference 2018 and China ODCC
2018 Summit. The Vicor advanced Power-on-Package technology enables Vertical Power Delivery (VPD) from the bottom side of the processor. VPD virtually eliminates Power Delivery Network
(PDN) losses while maximizing I/O capability and design flexibility.
Kyocera’s proprietary solutions to optimize processor performance and reliability are based on decades of
experience in package, module and motherboard manufacturing for customers worldwide. Kyocera has cultivated design expertise by
applying Vicor's Power-on-Package devices in multiple applications. By utilizing its design technology, simulation tools and
manufacturing experience, Kyocera provides optimal designs for complex I/O routing, high speed memory routing, and high-current
power delivery. Through collaboration, Kyocera and Vicor will bring new solutions for Artificial Intelligence (AI) and
high-performance processor applications to market.
About
KYOCERA
Kyocera Corporation (TOKYO:6971) (https://global.kyocera.com/), the parent and global
headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as “advanced ceramics”). By combining these engineered materials with
metals and integrating them with other technologies, Kyocera has become a leading supplier of semiconductor packages, industrial
and automotive components, electronic devices, solar power generating systems, printers, copiers and mobile phones. During the year
ended March 31, 2018, the company’s consolidated net sales totaled 1.58 trillion yen (approx. USD14.9 billion). Kyocera appears on
the “Derwent Top 100 Global Innovators 2018-19” list by Clarivate Analytics and is ranked #612 on Forbes magazine’s 2018 “Global
2000” list of the world’s largest publicly traded companies.
About Vicor
Vicor Corporation (NASDAQ: VICR) (http://www.vicorpower.com) designs, develops, manufactures and
markets modular power components and complete power systems based upon a portfolio of patented technologies. Headquartered in
Andover, Massachusetts, Vicor sells its products to the power systems market, including enterprise and high-performance computing,
industrial equipment and automation, telecommunications and network infrastructure, vehicles and transportation, aerospace and
defense. www.vicorpower.com
CONTACT:
Rainier Communications for Vicor Corporation (U.S.A.)
Colin Boroski +1-508-475-0025 x 142
cboroski@rainierco.com
or
KYOCERA Corporation (Japan)
Corporate Communications
Natsuki Doi+81-(0)75-604-3416
webmaster.pressgl@kyocera.jp
Fax: +81-(0)75-604-3516
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A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/ecc3fc6d-421b-4552-852f-6283d789df8f
Solution Diagram
Vicor and KYOCERA Solution Diagram