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Spectra7 Microsystems Inc V.SEV

Alternate Symbol(s):  SPVNF

Spectra7 Microsystems Inc. is an analog semiconductor company. The Company delivers analog semiconductors at a bandwidth, speed and resolution to enable disruptive industrial design for electronics manufacturers in virtual reality (VR), augmented reality (AR), mixed reality, data centers and other connectivity markets. It creates silicon products that enable copper cables to be longer, thinner, lighter and run at higher performance levels. Its family of products features a patented signal processing technology used in the design of active cables and specialty interconnects in data centers, VR, AR, and other connectivity products. It provides chips, such as HT8181 HDMI 2.0 In-Cable Equalizer, VR8200 Ultra-High-Speed DisplayPort Embedded Interconnect Processor, VR8300 Ultra-High-Speed DisplayPort Embedded Interconnect Processor, VR8050 Interconnect Processor, VR8051 Interconnect Processor, GC2502 Data Center Cable Processor, and GC1122 Dual Channel 112Gb/s PAM-4 Linear Equalizer.


TSXV:SEV - Post by User

Bullboard Posts
Comment by waterdirecton Dec 29, 2017 9:26am
221 Views
Post# 27244296

RE:Another Possible Reason For The Bear Pressure

RE:Another Possible Reason For The Bear Pressuresedar full disclosure......Look around and spend some time on sedar. Full of goodies.
Just remember......
Legitimate management. Tight lips.

Recent Developments

The following is a summary of material updates to the business of the Corporation since the date of the Interim Financials and Interim MD&A:

  •  On October 10, 2017, the Corporation announced the appointment of Antony Ng Yukshing as its Vice President of Operations.

  •  On November 6, 2017, the Corporation announced the appointment of Darren Ma as its Chief Financial Officer following the retirement of David Mier.

  •  On November 6, 2017, the Corporation announced a collaboration with Foxconn Interconnect Technology, Inc. to bring several new active copper data center interconnect products to market.

  •  On November 16, 2017, the Corporation announced a new product line optimized for blockchain processing data centers. The BCI-2500 product supports interconnects from 25 to 400Gbps.

  •  On November 22, 2017, the Corporation announced a strategic collaboration with MultiLane Technologies Inc. on establishing test procedures, best practices and measurement criteria for production testing of active copper cables for 400G data center applications.

  •  1,666,665 restricted share units granted to Raouf Halim, the Chief Executive Officer of the Corporation, will vest pursuant to the Corporations restricted share unit plan on or before December 22, 2017. On vesting, certain Common Shares will be sold in the ordinary course for tax purposes. 


Bullboard Posts