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Rubicon Technology to Present at Investor Conferences

RBCN
Rubicon Technology to Present at Investor Conferences

Rubicon Technology, Inc. (NASDAQ:RBCN), a leading provider of sapphire substrates and products to the LED, semiconductor, and optical markets, today announced that Rubicon executives will participate at four investor conferences in May 2013.

Raja M. Parvez, President and CEO, will present at the J.P. Morgan Technology, Media and Telecom Conference at the Westin Boston Waterfront in Boston, MA on Wednesday, May 15, 2013. Mr. Parvez’s presentation, scheduled for 3:30 p.m. Eastern Time, will be webcast live at http://rubicon-es2.com/index.php?page_id=5 under “Events” and will be archived for a limited time.

Bill Weissman, Vice President Finance and Chief Financial Officer, will present at the Jeffries Global Technology, Media and Telecom Conference in New York, NY, on Thursday, May 9, 2013. Mr. Weissman’s presentation, scheduled for 9:30 a.m. Eastern Time, will be webcast live at http://rubicon-es2.com/index.php?page_id=5 under “Events” and will be archived for a limited time.

Rubicon executives will also attend the Deutsche Bank 6th Annual Clean Tech, Utilities and Power Conference on Tuesday, May 14, 2013 at the Waldorf Astoria in New York, NY and the D.A. Davidson 5th Annual 1-1 Technology Forum on Wednesday, May 29, 2013 at the Grand Hyatt in New York, NY.

About Rubicon Technology

Rubicon Technology, Inc. is an advanced electronic materials provider that is engaged in developing, manufacturing and selling monocrystalline sapphire and other crystalline products for light-emitting diodes (LEDs), radio frequency integrated circuits (RFICs), blue laser diodes, optoelectronics and other optical applications. The Company applies its proprietary crystal growth technology to produce very high-quality sapphire in a form that allows for volume production of various sizes and orientations of substrates and windows. Rubicon is a vertically-integrated manufacturer with capabilities in crystal growth, high precision core drilling, wafer slicing, surface lapping, large-diameter polishing and wafer cleaning processes, which the Company employs to convert the bulk crystal into products with the quality and precision specified by its customers. The Company is the world leader in larger diameter products to support next-generation LED, RFIC and optical window applications.

Further information is available at www.rubicon-es2.com.