Amkor Technology to Present at Barclays 2013 High Yield Bond and Syndicated Loan Conference
Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it will
participate in the Barclays 2013 High Yield Bond and Syndicated Loan
Conference on Tuesday, May 21, 2013. Amkor’s presentation will occur at
11:30 am Central Time (12:30 pm Eastern Time) at the JW Marriott in
Chicago, IL.
An audio-only webcast of the presentation will be made available, both
live and by replay, on the Investor Relations section of Amkor’s website.
About Amkor
Amkor is a leading provider of semiconductor packaging and test services
to semiconductor companies and electronics OEMs. More information about
Amkor is available from the company's filings with the Securities and
Exchange Commission and at Amkor's website: www.amkor.com.
<div class="copyright">
Copyright Business Wire 2013
</div>