FormFactor to Participate in the Fifth Annual CEO Investor Summit

LIVERMORE, CA -- (Marketwired) -- 06/24/13 -- FormFactor Inc. (NASDAQ: FORM) is pleased to announce its participation in the 5th Annual CEO Investor Summit at the W Hotel in San Francisco on July 10, 2013, 12:30 pm Pacific Time.

About The 5th Annual CEO Summit

The CEO Summit is an accredited investor and publishing research analyst event that is held concurrently with SEMICON West and Intersolar 2013 in San Francisco. The event is hosted by executive management from participating companies and will feature a "round-robin" format consisting of small group meetings, each 25 minutes in duration.

The CEO Investor Summit is by invitation only and is open to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary.

While held concurrently with SEMICON West and Intersolar 2013, the event is not affiliated with the show.

RSVP Contacts for 5th Annual CEO Summit 2013

To RSVP for the CEO Summit, please contact either of the Summit's co-chairs.

Laura J. Guerrant-Oiye
Guerrant Associates
Phone: (808) 882-1467
Email: lguerrant@guerrantir.com

Claire E. McAdams
Headgate Partners LLC
Phone: (530) 265-9899
Email: claire@headgatepartners.com

About FormFactor

FormFactor Inc. (NASDAQ: FORM) is a leader in advanced wafer test solutions. The company's advanced wafer probe cards enable semiconductor manufacturers to lower their overall production costs, improve yields, and bring next-generation devices to market. FormFactor's acquisition of MicroProbe creates the leading wafer test solution provider for both memory and non-memory semiconductor manufacturers. FormFactor is headquartered in Livermore, California with operations in Europe, Asia and North America. For more information, visit the company's website at www.formfactor.com.

FormFactor, MicroProbe and the FormFactor and MicroProbe logos are registered or unregistered trademarks of FormFactor Inc. All other product, trademark, company or service names mentioned herein are the property of their respective owners.

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