ams AG (SIX:AMS), a leading provider of high performance analog ICs and
sensor solutions, today announced that it has invested over €25m to
create dedicated 3D IC production capacity at its wafer fabrication
plant near Graz, Austria.
The investment provides for the installation of new 3D IC equipment in
clean room space available at the plant, situated at the company’s
headquarters.
The additional production capacity comes in response to a surge in
demand outlook for ICs fabricated with 3D IC integration technology
developed exclusively by ams. The patented technology enables the design
and production of radically improved IC packages that are smaller and
offer better device performance than existing packages.
For instance, the TSV (Through-Silicon Via) interconnects in 3D ICs from
ams can replace the bond wires in conventional single-die devices. For
optical semiconductors, clear packaging requirements are eliminated to
enable production of chipscale packages that are smaller, cheaper, and
less vulnerable to EMI (electro-magnetic interference).
The ams 3D IC process also enables the production of stacked-die
devices. Two die produced in different processes (such as a photodiode
die and a silicon signal-processing die) are bonded back-to-back to
produce a monolithic stacked-die device. This can replace two separate
packages, has a far smaller footprint, and features much shorter
interconnects, resulting in improved performance and reduced electrical
noise.
The new equipment line, which will be fully operational by the end of
2013, will be available for production of 3D ICs for any ams product or
full-service foundry customer. Initially the line will produce devices
for customers in the medical imaging and mobile phone markets.
Kirk Laney, CEO of ams, commented: “The new 3D IC production line is a
substantial investment for a company the size of ams, and it
demonstrates once again our commitment to the development and deployment
of advanced analog semiconductor fabrication technology. Our customers
highly value our ability to implement innovative fabrication techniques,
and to offer production capacity with the ultra-high quality that they
require.”
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Copyright Business Wire 2013