Holds 55 PATENTS to its products:Products
The Company’s family of products features a patented signal processing technology used in the design of “active” cables and specialty interconnects which enable longer, thinner and lighter interconnects for VR, AR, in data centers, and for consumer connectivity products.
The Company holds approximately 55 patents relating to its products.
Virtual Reality (VR)
The Company’s next-generation VR products include the VR7050 which the Company believes to be the industry’s first chip capable of enabling lightweight, ultra-thin active interconnects for gesture recognition and motion control backhaul. When used in conjunction with Spectra7’s VR7100 high speed video chip, the chipset delivers ultrahigh bandwidth data, video, audio and power in a unified, ultra-light, super-thin wearable interconnect while achieving the low latency for a truly immersive VR experience.
Augmented Reality (AR)
The Company has also developed AR products that provide similar benefit to the VR Products on thinner, shorter ‘wearable’ interconnects. AR-Connect™ is an AR interconnect product line that is powered by the Company’s patented wearable network signal processing technology. The Company believes its patented AR-Connect™ is the industry’s first integrated cable, connector and embedded chipset product line for AR vision systems and wearable computing devices. ARConnect™ enables AR glasses to connect to a smart phone, proprietary processing device or a desktop GPU/laptop processing unit, with a single unified and ultra-thin link. Page 5
DreamWeVR™
DreamWeVR™ is an extensive product line targeted at next generation 4K Ultra-HD and 5K resolution VR and AR platforms for gaming, health care, architecture and business telepresence applications. The product line includes four new chips (VR8181, VR8050, VR8200 and VR8300) featuring SpectraLinear™ technology, new VRspecific connectors and three new head-mounted display (“HMD”) interconnect configurations to support highbandwidth (up to 50Gbps), near-zero latency VR HMDs and AR glasses with reduced weight and complexity.
Data Centers
GaugeChanger™ is an innovative and disruptive silicon technology that allows copper to extend much longer lengths without the cost and power penalty of optics that are used in data centers today. It works equally well at 25 Gbps NRZ and 50 Gbps PAM-4 enabling new connector standards of 100, 200 and 400 Gbps. At present, optics are the primary alternative for data centers seeking high speed, at lengths longer than a few meters. GaugeChanger™, however, extends the life of copper with interconnects that are as fast and as thin as fiber, but at dramatically lower cost and power consumption.
USB 3.2 consumer interconnects
The Company’s active VR8050 and VR8051 chips are the industry’s first for ultra-thin implementations of USB 3.2 consumer interconnects, reducing the conductor cross section by up to 90% compared to passive cable implementations. Applications for this interconnect implemented with the new Type-C connector include ultra-thin laptops, tablets, mobile devices, solid state disks and wearable computing devices. The resulting ultra-thin cable enabled by this new Spectra7 technology allows the cable to transfer data at supercomputer speeds (up to 10 times faster) with a plug shell or over-mold and cable strain relief dimension that is thinner than the mobile device itself, a critical dimension when implementing Type-C connectors in tablets and smart phones, and up to 90% lighter than passive cable conductors that would need to be much larger in diame
ter.