MoSys Announces Macnica Americas Support of GigaChip Interface for High-Performance Chip-to-Chip Communications
MoSys
(NASDAQ: MOSY), a leader in semiconductor solutions that enable fast,
intelligent data access for network and communications systems, today
announced that Macnica
Americas, a leader in semiconductor distribution and design services
with expertise in design services, applications support, chip-to-chip
communications protocols, and logistics, will support the GigaChip™
Interface in its distribution and technology innovation business.
The GigaChip Interface (GCI) is a scalable, high-performance, serial
protocol for chip-to-chip communications that is differentiated in
efficiency and reliability, resulting in system level benefits of
reduced power, cost and complexity. Current implementations built with
compatible CEI-11G or XFI SerDes electrical transport standards deliver
up to 144 Gigabits per second (Gbps) of full duplex data throughput
using 16 SerDes lanes when running at a 10G rate. A key differentiator
for the GCI protocol is high transport efficiency, even for small
payloads. Alternative serial interfaces are typically less than 50
percent efficient when transferring 8 bit and 16 bit data, which means
that they deliver less than half the performance at a given bandwidth.
The combination of 90 percent transport efficiency, from small to large
payloads, with power efficient short reach physical interconnect makes
GCI ideal for co-processor, memory, or multi-chip communication. The
interface also includes CRC error detection and automatic error recovery
provisions to meet the high reliability requirements of enterprise,
service provider, and mission-critical communications and compute
applications. GCI is an open, royalty-free interface specification
designed for use with MoSys’ Bandwidth
Engine® family of ICs and is suitable for any chip-to-chip
interconnect.
“As a provider of turnkey FPGA design services, we have substantial
expertise in high-speed communications protocols and networking, and
have seen firsthand the pain points caused by the limitations of more
traditional interface protocols,” said Marc Levy, Chief Technical
Officer for Macnica Americas. “We believe that leveraging the GigaChip
Interface for chip-to-chip communications in high-speed, high-density
complex FPGA designs provides the performance, efficiency and
reliability necessary to enable 100G systems and beyond.”
“Macnica Americas is one of North America’s leading providers of
high-performance semiconductor design and distribution services. We are
delighted to have Macnica’s support of the GigaChip Interface in its
FPGA design services and technology innovation business,” said John
Monson, Vice President of Marketing for MoSys. “Through our
collaboration and combined expertise in high-speed communications
protocols and networking, MoSys and Macnica are poised to provide
powerful solutions that connect MoSys’ Bandwidth Engine® ICs with
leading FPGAs through the GigaChip Interface, while delivering on fast
time-to-market requirements.”
About Macnica Americas
Macnica Americas Inc. is a subsidiary of the $2.4B Macnica group
headquartered in Yokohama, Japan. We offer franchised distribution in
North America with a design service center located in San Diego,
California. Our IP portfolio include solutions for high speed
networking, broadcast video, DSP and embedded applications. Find out
more about Macnica America’s suppliers and design services at www.macnica-na.com.
About MoSys, Inc.
MoSys, Inc. (NASDAQ: MOSY) is an IP-rich fabless semiconductor company
that provides high performance solutions for fast, intelligent data
access in network and communications systems. Engineered and built for
high-reliability carrier and enterprise applications, MoSys' products
are breaking bandwidth barriers™ in data processing to allow for faster
packet access and analysis, expanded user capacity and new capabilities
required by the expanding global infrastructure. MoSys' Bandwidth
Engine® family of ICs combines the company's patented 1T-SRAM®
high-density, embedded memory and high-speed, 10 Gigabits per second
serial interface with its intelligent access technology and a highly
efficient GigaChip™ Interface transport protocol to eliminate
bottlenecks in high-speed data access. MoSys is headquartered in Santa
Clara, California, and more information is available at www.mosys.com.
MoSys, 1T-SRAM and Bandwidth Engine are registered trademarks of
MoSys, Inc. in the US and/or other countries. Breaking Bandwidth
Barriers, GigaChip and the MoSys logo are trademarks of MoSys, Inc. All
other marks mentioned herein are the property of their respective owners.