PITTSBURGH, Aug. 31, 2017 (GLOBE NEWSWIRE) -- II‐VI Incorporated (NASDAQ:IIVI), a leading provider of solutions for
next generation optical networks today announced the introduction of its small form-factor dual interleaver platform for high bit
rate transmission and emerging applications in optical access networks.
A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/799fd6af-8b77-4231-9306-d0bbbd45e0c7
Next generation broadband access networks require compact equipment to fit in small spaces in the outside plant. II-VI’s small
37 x 39 x 12 mm dual interleavers are uniquely designed to enable network operators to increase capacity by deploying dense
wavelength division multiplexing (DWDM) technology in locations where space is at a premium such as in remote nodes or base
stations.
“By building on our heritage as a pioneer in interleaver technology and by leveraging our strong core competency in micro
optics, we achieved a small and cost-effective product to serve new high growth market opportunities including high bit rate
transmission and wireless access,” said Dr. Sanjai Parthasarathi, Vice President, Product Marketing and Strategy, Optical
Communications Group. “The very compact size and cost effectiveness was achieved by optimizing a vertically integrated design that
includes optical materials, coatings, components and assemblies.”
II-VI’s interleavers enable DWDM networks to increase transmission capacity efficiently by doubling the number of channels
within the same wavelength range. The small form-factor dual Interleaver platform features two interleavers, one for multiplexing
and another for de-multiplexing DWDM wavelengths, both in a single compact package. The product leverages II-VI’s advanced
Gires-Tournois etalon technology that features a wide channel passband and high adjacent channel isolation for high bit rate and
cascaded architectures. Its design is optimized to complement II-VI’s high performance wavelength add/drop thin-film filter
technology. II-VI’s small form-factor dual interleavers are available now for evaluation in sample quantities.
II-VI at ECOC 2017, Sep. 18-20, 2017, Booth #252
II-VI will showcase new products at ECOC 2017 that are driven by advances in our materials and technology platforms. The
product showcase will include differentiated subsystems solutions, highly compact optical amplifier solutions tailored to enable
high bit-rate DWDM transceivers, novel embedded monitoring solutions for transport networks, as well as key devices and
sub-assemblies for datacenter transceivers.
About II-VI Incorporated
II-VI Incorporated, a global leader in engineered materials and opto-electronic components is a vertically integrated
manufacturing company that develops innovative products for diversified applications in the industrial, optical communications,
military, life sciences, semiconductor equipment, and consumer markets. Headquartered in Saxonburg, Pennsylvania, with research and
development, manufacturing, sales, service, and distribution facilities worldwide, the Company produces a wide variety of
application-specific photonic and electronic materials and components, and deploys them in various forms including integrated with
advanced software to enable our customers. For more information, visit us at www.ii-vi.com.
CONTACT: Mark Lourie Dir. Corporate Communications mark.lourie@ii-vi.com www.ii-vi.com
